Flip Intermittent Vibration Ball Mill

1 vibration thb ac tc ptc htsl htol elfr edr wbs wbp sd pd sbs li em tddb hci nbti sm cdm lu ed char sc ser mech drop lt ds iwv design x conditions a only for peripheral routing b for symbol rework, new cure time, temp c if bond to leadfinger d design rule change e thickness only f mems element only g only from non-100 burned-in parts h hermetic.